[PDF.28wc] Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007

Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007

[PDF.ai40] Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007

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 | #6822216 in Books |  Springer |  2007-11-16 | Original language:English | PDF # 1 |  9.70 x.90 x6.70l,2.20 | File type: PDF | 463 pages

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This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.

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