[PDF.33te] Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

[PDF.uf03] Electrical Design of Through Silicon Via

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 | #5701364 in Books |  2014-05-12 | Original language:English | PDF # 1 |  9.21 x.69 x6.14l,1.29 | File type: PDF | 280 pages

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||From the Back Cover||Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approach

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verificat...

You can specify the type of files you want, for your gadget.Electrical Design of Through Silicon Via   |  From Springer. A good, fresh read, highly recommended.

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